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High-Precision Lapping and Polishing Media

Major applications of CMP slurries

Brittle material machining

Our CMP slurries are highly effective in terms of eliminating the risk of contamination within precision machining processes. Through strict material control, use of a thorough dispersion measure in the clean room and proper maintenance of our innovative facilities, heavy metallic materials, which are highly detrimental to semiconductors, and other bacterial and biological impurities are removed.

- CMP Slurry for fabrication of Cu interconnection of a semiconductor

Brittle material machining
Inquiry about the product can be made by:
e-mail : info@toppan-tl.co.jp
phone : +81-(0)3-6367-5568

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